Microelectronic substrate polishing systems, semiconductor wafer polishing systems, methods of polishing microelectronic substrates, and methods of polishing wafers
US6152808A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Aug 25, 1998 |
| Grant date | Nov 28, 2000 |
| Priority date | — |
| Expiry date | Aug 25, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Microelectronic substrate polishing systems and methods of polishing microelectronic substrates are described. In one embodiment, a substrate carrier includes a resilient member and a vacuum mechanism. The vacuum mechanism is coupled to the substrate carrier and configured to develop pressure sufficient to draw a portion of the resilient member toward the substrate carrier. The drawing of the resilient member effects an engagement between the resilient member and a substrate which is received by the substrate carrier. A polishing fluid sensor is provided and coupled intermediate the resilient member and the vacuum mechanism. In another embodiment, the polishing fluid sensor is coupled intermediate the substrate carrier and the vacuum mechanism. In another embodiment, the vacuum mechanism comprises a vacuum conduit through which a vacuum is developed. The polishing fluid sensor can be mounted on or in the vacuum conduit. Various types of fluid sensors can be utilized, including resistive, capacitive, pressure-based, and/or photo detectors. In a preferred embodiment, the microelectronic substrate comprises a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.