System and method for independent air bearing zoning for semiconductor polishing device
US6155915A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 1999 |
| Grant date | Dec 5, 2000 |
| Priority date | — |
| Expiry date | Mar 24, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B21/06
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing assembly for CMP of semiconductors includes an air bearing platen having multiple concentric rings of air holes, with each ring defining an air delivery zone. Each ring includes air source holes alternating with air drain holes. A distribution plate is mated with the platen, and the distribution plate has alternating rings of air supply and air exhaust rings. The air supply rings include air supply apertures that are aligned with the air source holes in the platen, and the air exhaust rings include air exhaust apertures that are aligned with the air drain holes in the platen. With this structure, the air distribution profile of each air delivery zone can be established relatively independently of the profiles of the other zones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.