Carrier head for chemical mechanical polishing a substrate
US6159079A · kind A · utility
106Cited by
20References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1998 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Sep 8, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with a lip portion to engage a substrate to form a seal for improved vacuum-chucking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.