Polishing head for a chemical mechanical polishing apparatus
US6159083A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1998 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Jul 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.