Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
US6159764A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1997 |
| Grant date | Dec 12, 2000 |
| Priority date | — |
| Expiry date | Jul 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (IC) package includes a transfer molded plastic or preformed ceramic package body, having an IC die positioned therein. A peripheral lead, Leads-Over-Chip (LOC), or Leads-Under-Chip (LUC) lead frame, includes a plurality of leads with portions enclosed within the package body that electrically connect to the IC die. A heat sink is positioned at least partially within the package body so a surface of a first portion of the heat sink faces the lead frame in close proximity to a substantial part, at least eighty percent, of the area of the enclosed portion of the lead frame to thereby substantially reduce an inductance associated with each of the leads. The heat sink is preferably grounded so it acts as a ground plane for the leads, but it may also be electrically isolated from the lead frame, or connected to a signal voltage. A die-attach area on the surface of the first portion of the heat sink is attached to the IC die, and a second portion of the heat sink is connected to the first portion substantially opposite the die-attach area and projects away from the first portion and the IC die to dissipate heat from the IC die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.