Carrier head for chemical mechanical polishing
US6162116A · kind A · utility
58Cited by
15References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1999 |
| Grant date | Dec 19, 2000 |
| Priority date | — |
| Expiry date | Jan 23, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a base and a flexible membrane extending beneath the base to define a pressurizable chamber. The flexible membrane may be secured to the base, to a retaining ring surrounding the mounting surface, or to a support structure movably connected to the base by, for example, an adhesive, an O-ring seal, a sealant, or by fitting the membrane into a recess. A lower surface of the flexible membrane provides a mounting surface for a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.