Electronic component and method of manufacture
US6164523A · kind A · utility
124Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1998 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Jul 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an electronic component includes providing a substrate (101), forming a semiconductor device in the substrate (101), depositing a metal layer (107) over the substrate (101) and electrically coupled to the semiconductor device, depositing a layer (108) of solder over the metal layer, and wire bonding a wire (109) to the metal layer (107).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.