Ball grid array (BGA) encapsulation mold
US6164946A · kind A · utility
8Cited by
28References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 13, 1999 |
| Grant date | Dec 26, 2000 |
| Priority date | — |
| Expiry date | Jul 13, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/812
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.