Method to increase contact area
US6169017A · kind A · utility
Assignees
Inventor
Key dates
| Filing date | Nov 23, 1999 |
| Grant date | Jan 2, 2001 |
| Priority date | — |
| Expiry date | Nov 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/518
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fabrication method to increase the gate contact area is described, in which a conformal first sacrificial layer is formed on the silicon substrate and the gate structure. A second sacrificial layer is further formed on the silicon substrate, wherein the surface of the second sacrificial layer is lower than the top of the polysilicon gate by a certain thickness. The exposed sacrificial layer is then removed, followed by forming a conformal silicon layer to cover the silicon substrate. A spacer is further formed on a sidewall of the gate structure. Using the spacer as a mask, the exposed polysilicon layer is removed to form a side-wing polysilicon layer on both sides of the gate to increase the contact area of the gate. The spacer, the second sacrificial layer and the first sacrificial layer are then removed. A silicidation process is further conducted to form a silicide layer on the gate structure and the two side-wing polysilicon layer to lower the gate contact resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.