Method and apparatus for processing a wafer
US6170433A · kind A · utility
7Cited by
4References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 23, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Jul 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor processing system includes a processing chamber, a rotatable shaft extending into the chamber, and a wafer holder in the chamber. The rotatable shaft has a gas flow passage therethrough. The wafer holder is capable of supporting a wafer in position in the chamber so that the processing gas flow passage directs flow onto a face of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.