Chemically amplified resist
US6171755A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Jan 9, 2001 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/127
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A chemically amplified resist for electron beam lithography contains the following components: PA1 a polymer with dissolution-inhibiting groups that can be cleaved with acid catalysis, PA1 a photo-reactive compound, which upon electron irradiation releases a sulfonic acid with a pK.sub.a value .ltoreq.2.5 (photo acid generator), PA1 an electron-beam-sensitive sensitizer enhancing the exposure sensitivity of the resist, such as a fluorene derivative, and PA1 a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.