Patent · US Expired

Chemically amplified resist

US6171755A · kind A · utility

13Cited by
2References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 30, 1998
Grant dateJan 9, 2001
Priority date
Expiry dateNov 30, 2018

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S430/127
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A chemically amplified resist for electron beam lithography contains the following components: PA1 a polymer with dissolution-inhibiting groups that can be cleaved with acid catalysis, PA1 a photo-reactive compound, which upon electron irradiation releases a sulfonic acid with a pK.sub.a value .ltoreq.2.5 (photo acid generator), PA1 an electron-beam-sensitive sensitizer enhancing the exposure sensitivity of the resist, such as a fluorene derivative, and PA1 a solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.