Ball bonding method on a chip
US6176417A · kind A · utility
6Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1999 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball bonding method on a chip mainly comprises steps of: a wire is burned to form a ball on a capillary; the capillary is moved down to a second bonding point for ball bonding; and the capillary is moved up in a vertical direction thereby pulling the tip of the ball to be cut such that the ball has a uniformly body shape and tip height. Therefore, the ball provides uniform body shape and tip height for wire bonding at a second bonding point under lower variability conditions thus increasing the reliability of products.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.