Method for fabricating a metal-oxide semiconductor device
US6177336A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Nov 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/0217
Abstract
A method for fabricating a metal-oxide semiconductor (MOS) transistor is provided. The method has steps of sequentially forming an oxide layer, a polysilicon layer and a cap layer on a semiconductor substrate to form a first-stage gate. An interchangeable source/drain region with a lightly doped drain (LDD) structure is formed in the substrate at each side of the first-stage gate. An insulating layer is formed over the substrate, and is planarized so as to exposed the cap layer. Removing the exposed cap layer forms an opening that exposes the polysilicon layer. Using the insulating layer as a mask, a self-aligned selective local implantation process is performed to form a threshold-voltage doped region and an anti-punch-through doped region below the oxide layer in the substrate. A conductive layer is formed over the substrate to fill the opening. A chemical mechanical polishing process is performed to expose the insulating layer so that a remaining portion of the conductive layer fills the opening to form together with the polysilicon layer and the oxide layer to serve as an gate structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.