Low temperature via fill using liquid phase transport
US6177348A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1998 |
| Grant date | Jan 23, 2001 |
| Priority date | — |
| Expiry date | Jan 20, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/926
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for depositing materials on a surface, having the following steps: a) obtaining a surface having at least feature thereon, the surface and the feature having a layer of first material deposited thereon, the first material not filling substantially all of the feature; b) depositing a layer of a second material on the first material, wherein the melting point of the second material is less than that of the first material, and wherein the first material is soluble in the second material at a temperature less than the melting point of the first material; and c) heating the surface to a first temperature of at least equal to the melting point of the second material and at most equal to the melting point of the first material, wherein substantially all of the via is filled with the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.