Method and apparatus for treating surface including virtual anode
US6179983A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1997 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | Nov 13, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/07
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for depositing an electrical conductive layer on the surface of a wafer includes a virtual anode located between the actual anode and the wafer. The virtual anode modifies the electric current flux and plating solution flow between the actual anode and the wafer to thereby modify the thickness profile of the deposited electrically conductive layer on the wafer. The virtual anode can have openings through which the electrical current flux passes. By selectively varying the radius, length, or both, of the openings, any desired thickness profile of the deposited electrically conductive layer on the wafer can be readily obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.