Steve Taatjes
6Patents
6h-index
12Co-inventors
52Inventor score
Filing activity: Nov 13, 1997 → Feb 3, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6179983A | Method and apparatus for treating surface including virtual anode | Emerging Cross-Sectional Technologies | 209 | Expired |
| US6159354A | Electric potential shaping method for electroplating | Chemistry; Metallurgy | 146 | Expired |
| US6402923B1 | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element | Emerging Cross-Sectional Technologies | 102 | Expired |
| US6193859A | Electric potential shaping apparatus for holding a semiconductor wafer during electroplating | Chemistry; Metallurgy | 74 | Expired |
| US6537416B1 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Electricity | 36 | Expired |
| US6967174B1 | Wafer chuck for use in edge bevel removal of copper from silicon wafers | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.