Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sink
US6181006A · kind A · utility
14Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 1998 |
| Grant date | Jan 30, 2001 |
| Priority date | — |
| Expiry date | May 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical assembly includes an IC package having a thermally conductive mounting flange in contact with a heat sink. A thermally conductive casing is secured to the heat sink, the casing at least partially enclosing the IC package. A resilient retaining member is disposed between the casing and IC package, the retaining member applying sufficient force on the IC package so as to maintain good thermal contact between the mounting flange and heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.