Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system
US6183564A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1998 |
| Grant date | Feb 6, 2001 |
| Priority date | — |
| Expiry date | Nov 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a substrate in a processing system having multiple process chambers and a common transfer chamber comprises a process chamber having a process space to receive and process a substrate and a buffer chamber defining a buffer space. The buffer chamber is positioned beneath the process chamber and is configured for interfacing with a transfer chamber of a processing system for receiving a substrate to be processed. A passage is formed between the process and buffer chambers for moving a substrate between the process space and buffer space and a movable substrate stage in the buffer space is operable for moving vertically in said passage between a first position wherein the substrate is positioned in the buffer space and a second position wherein the substrate is positioned within the process space of the process chamber. A sealing mechanism is operable for sealing said passage to isolate the process chamber and a pumping system is coupled to the buffer chamber for purging the buffer space of contaminants which may leak from the process chamber to generally reduce the escape of the contaminants through the buffer chamber and into the common transfer chamber a…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.