Manufacturing method for micromechanical component

US6187607A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Michael Offenberg · Lörrach, DE
• Udo Bischof · Wannweil, DE
• Markus Lutz · Palo Alto, US

Key dates

• Filing date: Apr 15, 1999
• Grant date: Feb 13, 2001
• Expiry date: Apr 15, 2019

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2201/053
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A manufacturing method for a micromechanical component, and in particular for a micromechanical rotation rate sensor, which has a supporting first layer, an insulating second layer that is arranged on the first layer, and a conductive third layer that is arranged on the second layer. The method includes the following steps: provide the second layer, in the form of patterned first and second insulation regions, on the first layer; provide a first protective layer on an edge region of the first insulation regions and on a corresponding boundary region of the first layer; provide the third layer on the structure resulting from the previous steps; pattern out a structure of conductor paths running on the first insulation regions, and a functional structure of the micromechanical component above the second insulation regions, from the third layer; and remove the second layer in the second insulation regions, the second layer being protected in the first insulation regions by the first protective layer in such a way that it is essentially not removed there.