Polishing pad, method and apparatus for treating polishing pad and polishing method
US6190238A · kind A · utility
12Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1999 |
| Grant date | Feb 20, 2001 |
| Priority date | — |
| Expiry date | Mar 5, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for pressing a work to be polished to a surface thereof, includes a structure obtained by being compressed under a temperature which is higher than an operating temperature for polishing the work and/or under a pressure which is equal or higher than an operating pressure for polishing the work. A method for polishing a includes the step of polishing the work by using the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.