Parallel plate apparatus for in-situ vacuum line cleaning for substrate processing equipment

US6193802A · kind A · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Ben Pang · Oakland, US
• David Cheung · Foster City, US
• William Taylor · Dublin, US
• Sebastien Raoux · San Francisco, US
• Mark Fodor · Los Gatos, US

Key dates

• Filing date: Oct 30, 1996
• Grant date: Feb 27, 2001
• Expiry date: Oct 30, 2016

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

An apparatus for minimizing deposition in an exhaust line of a substrate processing chamber. The apparatus includes first and second electrodes having opposing surfaces that define a fluid conduit between them. The fluid conduit includes an inlet, an outlet and a collection chamber between the inlet and the outlet. The apparatus is connected at its inlet to receive the exhaust of the substrate processing chamber. The collection chamber is structured and arranged to collect particulate matter flowing through the fluid conduit and to inhibit egress of the particulate matter from the collection chamber. A plasma generation system supplies power to the electrodes to form a plasma from etchant gases within the fluid conduit. Constituents from the plasma react with the particulate matter collected in the collection chamber to form gaseous products that may be pumped out of the fluid conduit. The apparatus may further include an electrostatic collector to enhance particle collection in the collection chamber and to further inhibit egress of the particulate matter.