Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents
US6193860A · kind A · utility
58Cited by
5References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 23, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Apr 23, 2019 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for optimizing electrical currents to improve copper plating uniformity on a semiconductor wafer is disclosed. The use of multiple anodes of the embodiment provides for variable electrical currents to the semiconductor wafer, the variable feature of the variable electrical currents compensating for non-uniform electroplating characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.