Microelectronic assemblies with multiple leads
US6194291A · kind A · utility
153Cited by
48References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Aug 9, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic connection component includes a support such as a dielectric sheet having elongated leads extending along a surface. The leads have terminal ends permanently connected to the support and tip ends releasably connected to the support. The support is juxtaposed with a further element such as a semiconductor chip or wafer, and tip ends of the leads are bonded to contacts on the wafer using a bonding tool advanced through holes in the support. After bonding, the support and the further element are moved away from one another so as to deform the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.