Flip chip with integrated flux and underfill
US6194788A · kind A · utility
36Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1999 |
| Grant date | Feb 27, 2001 |
| Priority date | — |
| Expiry date | Mar 10, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.