3 point vacuum chuck with non-resilient support members
US6196532A · kind A · utility
41Cited by
21References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 27, 1999 |
| Grant date | Mar 6, 2001 |
| Priority date | — |
| Expiry date | Aug 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The present invention generally provides a workpiece handling device and, more particularly, a vacuum operated chuck for securing a substrate to a substrate handling device. In one embodiment, the invention provides a chuck having three vacuum chuck rings projecting from a chuck base and having no resilient materials such as o-rings or the like exposed to the operating environment within which the wafer is being handled. In another embodiment, the present invention provides a substrate handling chuck having removable vacuum chuck rings for permitting interchangeable chuck ring elements for a particular application.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.