Removal of dielectric oxides
US6200891A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1998 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Aug 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Oxides such as those commonly used in interlevel dielectrics may be removed employing a liquid composition containing a fluoride-containing compound and an organic solvent. Preferred compositions are substantially nonaqueous and include an anhydride. Improved methods for selective removal of oxides, especially for removal of silicon oxides where pre-exposed (or conductive metal - containing) features are present, where metal (conductive metal - contaimg) features are to be exposed by the desired oxide removal, or where the silcon oxide otherwise contacts metal (or conductive metal - containing) features are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.