Substrate structure of BGA semiconductor package
US6201299A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1999 |
| Grant date | Mar 13, 2001 |
| Priority date | — |
| Expiry date | Jun 23, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate structure mainly comprises a plurality of substrate units and a plurality of dispensing holes thereon. A main hole is provided on the surface of the substrate unit, the two ends of which are adjacent to the dispensing hole for dispensing liquified encapsulant material to form a semiconductor package. The semiconductor package mainly comprises a chip, a substrate and an encapsulant. The chip is adhesively attached to the substrate, and the encapsulant covers around the are along one side of the chip. Then the encapsulant flows from the upper surface of the substrate to the lower surface to cover wire areas by means of the liquified encapsulant material flowing through the dispensing hole from the upper surface of the substrate to the lower surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.