Modular semiconductor workpiece processing tool
US6203582A · kind A · utility
74Cited by
33References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1996 |
| Grant date | Mar 20, 2001 |
| Priority date | — |
| Expiry date | Jul 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides for a semiconductor workpiece processing tool. The semiconductor workpiece processing tool includes an interface section comprising at least one interface module and a processing section comprising a plurality of processing modules for processing the semiconductor workpieces. The semiconductor workpiece processing tool has a conveyor for transferring the semiconductor workpieces between the interface modules and the processing modules.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.