Robert W. Berner
30Patents
17h-index
28Co-inventors
77Inventor score
Filing activity: Apr 28, 1994 → Sep 22, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6004440A | Cathode current control system for a wafer electroplating apparatus | Emerging Cross-Sectional Technologies | 83 | Expired |
| US6203582A | Modular semiconductor workpiece processing tool | Emerging Cross-Sectional Technologies | 74 | Expired |
| US5544421A | Semiconductor wafer processing system | Emerging Cross-Sectional Technologies | 72 | Expired |
| US5660517A | Semiconductor processing system with wafer container docking and loading station | Emerging Cross-Sectional Technologies | 63 | Expired |
| US5678320A | Semiconductor processing systems | Emerging Cross-Sectional Technologies | 59 | Expired |
| US6120641A | Process architecture and manufacturing tool sets employing hard mask patterning for use in the manufacture of one or more metallization levels on a workpiece | Electricity | 51 | Expired |
| US6627051B2 | Cathode current control system for a wafer electroplating apparatus | Emerging Cross-Sectional Technologies | 50 | Expired |
| US6440178B1 | Modular semiconductor workpiece processing tool | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5731678A | Processing head for semiconductor processing machines | Electricity | 44 | Expired |
| US6139703A | Cathode current control system for a wafer electroplating apparatus | Emerging Cross-Sectional Technologies | 43 | Expired |
| US5954911A | Semiconductor processing using vapor mixtures | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6322674A | Cathode current control system for a wafer electroplating apparatus | Emerging Cross-Sectional Technologies | 33 | Expired |
| US5784797A | Carrierless centrifugal semiconductor processing system | Electricity | 32 | Expired |
| US6843894B2 | Cathode current control system for a wafer electroplating apparatus | Chemistry; Metallurgy | 20 | Expired |
| US7087143B1 | Plating system for semiconductor materials | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6014817A | Semiconductor wafer processing system | Emerging Cross-Sectional Technologies | 18 | Expired |
| US5882168A | Semiconductor processing systems | Emerging Cross-Sectional Technologies | 17 | Expired |
| US5836736A | Semiconductor processing system with wafer container docking and loading station | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6001234A | Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot | Chemistry; Metallurgy | 14 | Expired |
| US5784802A | Semiconductor processing systems | Emerging Cross-Sectional Technologies | 14 | Expired |
| US5996241A | Semiconductor wafer processing system with immersion module | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5788454A | Semiconductor wafer processing system | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6162734A | Semiconductor processing using vapor mixtures | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6454926B1 | Semiconductor plating system workpiece support having workpiece-engaging electrode with submerged conductive current transfer areas | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6833035B1 | Semiconductor processing system with wafer container docking and loading station | Emerging Cross-Sectional Technologies | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.