Semiconductor device having a ball grid array and a fabrication process thereof
US6207477A · kind A · utility
21Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 1998 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Feb 11, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20752
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a semiconductor device includes a step of attaching a circuit substrate on a semiconductor wafer in alignment with each other, providing an electrical interconnection between the circuit substrate and semiconductor devices formed in the wafer, providing solder bumps on the circuit substrate, and dicing the semiconductor wafer together with the circuit substrate thereon along a scribe line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.