Temporary interconnect for semiconductor devices
US6208027A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1999 |
| Grant date | Mar 27, 2001 |
| Priority date | — |
| Expiry date | Mar 30, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a bump nest which allows a semiconductor device to be temporarily connected with a package without having to be fused to the package. The disclosed temporary interconnect includes a contact group comprising at least three projecting contact elements. Each of the respective contact elements includes a projecting contact guide, which is concentrically located on an encircling contact. The projecting contact guides and the encircling contact are spaced in a manner so as to surround a ball or a bump of the semiconductor device. In the preferred embodiment, the temporary interconnect may also include a base pad on which each of the encircling contacts is accurately positioned to surround the ball or bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.