Mohammad Khan
21Patents
8h-index
25Co-inventors
71Inventor score
Filing activity: Oct 27, 1993 → Apr 14, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5572692A | Memory configuration decoding system having automatic row base address generation mechanism for variable memory devices with row access interleaving | Physics | 23 | Expired |
| US6103549A | No clean flux for flip chip assembly | Electricity | 16 | Expired |
| US5988485A | Flux cleaning for flip chip technology using environmentally friendly solvents | Electricity | 15 | Expired |
| US6382500B1 | Solder reflow furnace with flux effluent collector and method of preventing flux contamination | Electricity | 14 | Expired |
| US7544542B2 | Reduction of damage to thermal interface material due to asymmetrical load | Electricity | 13 | Active |
| US7513035B2 | Method of integrated circuit packaging | Emerging Cross-Sectional Technologies | 10 | Active |
| US6671450B2 | Apparatus and method to metallize, reinforce, and hermetically seal multiple optical fibers | Physics | 9 | Expired |
| US6417563B1 | Spring frame for protecting packaged electronic devices | Electricity | 8 | Expired |
| US6617195B1 | Method of reflowing organic packages using no-clean flux | Electricity | 7 | Expired |
| US7633151B2 | Integrated circuit package lid with a wetting film | Electricity | 6 | Active |
| US6098867A | Automated brush fluxing system for application of controlled amount of flux to packages | Electricity | 5 | Expired |
| US6409070B1 | Minimizing flux residue by controlling amount of moisture during reflow | Electricity | 5 | Expired |
| US6857790B2 | Apparatus and method to vertically route and connect multiple optical fibers | Physics | 4 | Expired |
| US6371310B1 | Boat for land grid array packages | Electricity | 4 | Expired |
| US6722553B2 | Controlled and programmed deposition of flux on a flip-chip die by spraying | Electricity | 3 | Expired |
| US7923850B2 | Semiconductor chip with solder joint protection ring | Electricity | 2 | Active |
| US6488158B1 | Boat for organic and ceramic flip chip package assembly | Electricity | 2 | Expired |
| US8297986B2 | Integrated circuit socket | Electricity | 2 | Active |
| US6208027A | Temporary interconnect for semiconductor devices | Electricity | 2 | Expired |
| US8232138B2 | Circuit board with notched stiffener frame | Emerging Cross-Sectional Technologies | 1 | Active |
| US6812570B2 | Organic packages having low tin solder connections | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.