Method of mounting bumped electronic components
US6209196A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 21, 1999 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Jan 21, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49211
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting bumped electronic components without using a flux during the solder joining process, which is low in cost and offers high reliability of the assembly. Resin adhesive 4 containing filler particles 4a is applied to a board 1 formed with electrodes 2, and a bumped electronic component 5 is mounted onto the board 1 to press the bumps 7 of the electronic component 5 against the electrodes 2 of the board 1. As a result, the oxide films 7a over the surfaces of the solder bumps 7 are broken by the filler particles 4a present in a gap between the lower ends of the solder bumps 7 and the surfaces of the electrodes 2, thus exposing the solder. This process eliminates the need for using the flux when the solder bumps 7 are melted and soldered to the electrodes 2, and therefore the cleaning process after soldering is not required, assuring high reliability of the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.