Carrier head for chemical mechanical polishing a substrate
US6210255A · kind A · utility
65Cited by
18References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1999 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | Apr 22, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane with an expandable lip portion to engage a substrate for improved chemical mechanical polishing. The lip portion can form or break a seal with the substrate in response to pressure changes in a chamber in the carrier head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.