Method and apparatus for producing a uniform density plasma above a substrate
US6210539A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 1997 |
| Grant date | Apr 3, 2001 |
| Priority date | — |
| Expiry date | May 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for processing a substrate in the presence of a plasma, the apparatus including: a chamber enclosing a region maintained at a low pressure; a substrate support disposed in the region and having a substantially horizontal substrate support surface for supporting a substrate; and a coil disposed in the chamber and for producing a radio frequency field within the chamber to create an ionizing plasma above the substrate support surface, the coil being disposed for maintaining a plasma having equipotential lines which extend substantially parallel to the upper surface of the substrate across substantially the entire upper surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.