Process for enhancing refresh in dynamic random access memory devices

US6211007A · kind A · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Kirk D. Prall · Boise, US
• Robert Kerr · Boise, US
• Christopher Murphy · Boise, US
• D. Mark Durcan · Boise, US

Key dates

• Filing date: Jun 3, 1997
• Grant date: Apr 3, 2001
• Expiry date: Jun 3, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10B12/033

Abstract

A process for enhancing refresh in Dynamic Random Access Memories wherein n-type impurities are implanted into the capacitor buried contact after formation of the access transistor components. The process comprises forming a gate insulating layer on a substrate and a transistor gate electrode on the gate insulating layer. First and second transistor source/drain regions are formed on the substrate adjacent to opposite sides of the gate electrodes. N-type impurities, preferably phosphorous atoms, are then implanted into the first source/drain region which will serve as the capacitor buried contact.