Assembling a stacked die package
US6212767A · kind A · utility
165Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Aug 31, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The technique involves attaching a smaller die to a larger die without using a die attach machine. The larger die may be attached to a support structure using a die attach machine. In some embodiments, the larger die is affixed to the support structure first and in other embodiments, the smaller die is affixed to the larger die first.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.