Patrick W. Tandy
42Patents
15h-index
15Co-inventors
74Inventor score
Filing activity: May 15, 1997 → Oct 10, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5986209A | Package stack via bottom leaded plastic (BLP) packaging | Electricity | 252 | Expired |
| US6212767A | Assembling a stacked die package | Emerging Cross-Sectional Technologies | 165 | Expired |
| US6331453A | Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities | Electricity | 116 | Expired |
| US6210992A | Controlling packaging encapsulant leakage | Electricity | 103 | Expired |
| US6718163B2 | Methods of operating microelectronic devices, and methods of providing microelectronic devices | Electricity | 99 | Expired |
| US6542720B1 | Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices | Electricity | 98 | Expired |
| US6265660A | Package stack via bottom leaded plastic (BLP) packaging | Electricity | 82 | Expired |
| US7107019B2 | Methods of operating microelectronic devices, and methods of providing microelectronic devices | Electricity | 79 | Expired |
| US7593708B2 | Methods of operating electronic devices, and methods of providing electronic devices | Electricity | 77 | Active |
| US7778621B2 | Methods of operating electronic devices, and methods of providing electronic devices | Electricity | 74 | Active |
| US8036629B2 | Methods of operating electronic devices, and methods of providing electronic devices | Electricity | 72 | Active |
| US6577004B1 | Solder ball landpad design to improve laminate performance | Electricity | 67 | Expired |
| US6660558B1 | Semiconductor package with molded flash | Electricity | 23 | Expired |
| US6146919A | Package stack via bottom leaded plastic (BLP) packaging | Electricity | 21 | Expired |
| US6140695A | Compression layer on the leadframe to reduce stress defects | Electricity | 18 | Expired |
| US6521980B1 | Controlling packaging encapsulant leakage | Electricity | 13 | Expired |
| US6403457B2 | Selectively coating bond pads | Electricity | 11 | Expired |
| US5923081A | Compression layer on the leadframe to reduce stress defects | Electricity | 10 | Expired |
| US6166328A | Package stack via bottom leaded plastic (BLP) packaging | Electricity | 9 | Expired |
| US6392289B1 | Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same | Electricity | 8 | Expired |
| US6395579B2 | Controlling packaging encapsulant leakage | Electricity | 7 | Expired |
| US6899534B2 | Mold assembly for a package stack via bottom-leaded plastic (blp) packaging | Electricity | 7 | Expired |
| US6404216B1 | Test contact | Electricity | 6 | Expired |
| US6429385B1 | Non-continuous conductive layer for laminated substrates | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6188021A | Package stack via bottom leaded plastic (BLP) packaging | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.