Pedestal with a thermally controlled platen
US6214121A · kind A · utility
3Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Jul 7, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S156/915
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A semiconductor wafer processing apparatus, and more specifically, an apparatus containing a pedestal assembly having a thermally controlled platen for providing a controllable, uniform temperature distribution across the diameter of a semiconductor wafer. The thermally controlled platen heats and cools the semiconductor wafer placed upon the platen so the workpiece may be maintained uniformly at a predetermined temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.