Elevated image sensor array which includes isolation between uniquely shaped image sensors

US6215164A · kind A · utility

Assignee

• AGILENT TECHNOLOGIES, INC. · US

Inventors

• Min Cao · Hsinchu, TW
• Jeremy Alfred Theil · Mountain View, US
• Gary W. Ray · Mountain View, US
• Dietrich W. Vook · Los Altos, US
• Shawming Ma · Sunnyvale, US

Key dates

• Filing date: Jul 26, 1999
• Grant date: Apr 10, 2001
• Expiry date: Jul 26, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48463

Abstract

An image pixel sensor array. The image pixel sensor array includes a substrate. An interconnect structure is formed adjacent to the substrate. A plurality of image pixel sensors are formed adjacent to the interconnect structure. Each image pixel sensor includes a pixel electrode, and an I-layer formed adjacent to the pixel electrode. The I-layer includes a first surface adjacent to the pixel electrode, and a second surface opposite the first surface. The first surface includes a first surface area which is less than a second surface area of the second surface. The image pixel sensor array further includes an insulating material between each image pixel sensor, and a transparent electrode formed over the image pixel sensors. The transparent electrode electrically connects the image pixel sensors and the interconnect structure.