Multichip modules and manufacturing method therefor
US6215193A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1999 |
| Grant date | Apr 10, 2001 |
| Priority date | — |
| Expiry date | Apr 21, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multichip module includes a substrate having two padding strips, a first chip, and a second chip mounted thereon. The padding strips are mounted to two sides of the first chip. The second chip is disposed above the first chip in a manner that the bonding pads of the first chip are exposed outside the lateral edges of the second chip. In another embodiment of the invention, the substrate includes a recess, a first chip, and a second chip. The first chip is received in the first chip, and the second chip is disposed above the first chip in a manner that the bonding pads of the first chip are exposed outside the lateral edges of the second chip. A method is provided to manufacture a multichip module by placing a first chip on a substrate and then placing a second chip above the first chip in a manner that the bonding pads of the first chip are exposed outside the lateral edges of the second chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.