Semiconductor fabrication extended particle collection cup
US6217936A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 1999 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Feb 26, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C11/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved particle-collecting cup using a fabrication protective device for use in processing semiconductor wafers includes a deflective surface, a protective shield and a protective lip to protect the surface of the semiconductor. The deflective surface encircles the semiconductor and extends both above and below the semiconductor at an inclined angle. The radius of the opening formed by the upper end of the deflective surface is at least as small as the radius of the semiconductor. The protective shield extends downward toward the semiconductor and the protective lip is inclined outward. Any particles spun off from the fluid coating of the semiconductor that may have been reflected are guided away from the surface of the semiconductor by the semiconductor fabrication extended particle collection cup.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.