Photosensitive resin composition and making process
US6218069A · kind A · utility
6Cited by
3References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 10, 2000 |
| Grant date | Apr 17, 2001 |
| Priority date | — |
| Expiry date | Jan 10, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/023
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition contains a photosensitive resin comprising recurring units of formula (1) and having a Mw of 1,300-11,000 and 20-5,000 ppm of a tertiary amine compound of formula (2). ##STR1## R is hydrogen or a 1,2-naphthoquinonediazido-5-sulfonic acid residue, the content of 1,2-naphthoquinonediazido-5-sulfonic acid residue in R is 3-27 mol %, and m is a number from 0 to 3, X is a C.sub.6-20 alkyl, aryl or aralkyl group, Y and Z each are a C.sub.1-20 alkyl group. The composition is improved in sensitivity stability and adhesion to substrates and eliminates the risk of causing corrosion of metal substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.