Patent · US Expired

Transistor having reverse self-aligned structure

US6218690A · kind A · utility

6Cited by
8References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 16, 1999
Grant dateApr 17, 2001
Priority date
Expiry dateAug 16, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/027

Abstract

A reverse self-aligned field effect transistor and a method of fabricating the same are provided. The reverse self-aligned transistor includes a source formed on an active region of a semiconductor substrate and a drain formed on the active region of the semiconductor substrate, the drain being positioned a predetermined distance from the source. A silicide film is formed on the source and the drain. Insulative film spacers are formed on sidewalls of a trench, the trench being formed by etchin the semiconductor substrate between the source and the drain. A gate insulative film is formed on a lower portion of the trench and a metal gate is formed on the gate insulative film between the insulative film spacers. The metal gate is electrically isolated from the source and the drain by the insulative film spacers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.