Low profile multi-IC chip package connector
US6225689A · kind A · utility
181Cited by
42References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2000 |
| Grant date | May 1, 2001 |
| Priority date | — |
| Expiry date | Aug 14, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low profile multi-IC chip package for high speed application comprises a connector for electrically connecting the equivalent outer leads of a set of stacked primary semiconductor packages. In one embodiment, the connector comprises a two-part sheet of flexible insulative polymer with buses formed on one side. In another embodiment, the connector comprises multiple buses formed from conductive polymer. In further embodiments, the primary packages are stacked within a cage and have their outer leads in unattached contact with buses within the cage or, alternatively, are directly fixed to leads or pads on the host circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.