Photo-sensitive material, method of forming a resist pattern and manufacturing an electronic parts using photo-sensitive material
US6228552A · kind A · utility
16Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1997 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Sep 10, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2024
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive material, which comprises, an alkali-soluble resin moiety having an alicyclic skeleton, a polycyclic condensation skeleton, or both alicyclic and polycyclic condensation skeletons, and a diazo compound moiety. The diazo compound moiety may be contained in a side chain of the alkali-soluble resin moiety or included in the photosensitive material in separate from the alkali-soluble resin moiety.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.