Flip chip with integrated mask and underfill
US6228678A · kind A · utility
68Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Mar 10, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.