Flip chip having integral mask and underfill providing two-stage bump formation
US6228681A · kind A · utility
43Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Sep 14, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a process for forming a two-stage bump on a flip chip. The process employs an underfill material which can be formed to act as a mask for application of bumps formed from a first composition to the flip chip. A material having a different composition can then be applied to the bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.