Organic pin grid array flip chip carrier package
US6229207A · kind A · utility
14Cited by
20References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2000 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Jan 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15312
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An organic carrier member for mounting a semiconductor device is provided that has a plurality of pin leads joined to conductive pads on the carrier member by a solder fillet having a reflow temperature higher than the temperature necessary to attach the semiconductor device. Embodiments include a bismaleimide-triazine epoxy laminate carrier member having an array of pins joined to the carrier member by a solder fillet having a reflow temperature of no greater than 275.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.