Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability
US6229702A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1999 |
| Grant date | May 8, 2001 |
| Priority date | — |
| Expiry date | Jun 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A ball grid array semiconductor package includes a substrate, a die mounted on the substrate and electrically connected to the substrate by bonding wires, a heat ring mounted on the substrate to surround the die and the bonding wires, and a heat slug mounted on the heat ring to entirely cover the die and the bonding wires thereby providing improved heat dissipation efficiency and overall electrical performance. Encapsulation material is filled into an inner space surrounded by the heat ring, heat slug and substrate to form an encapsulant for protecting the die and bonding wires. The heat ring and heat slug has at least a portion of surface area sequentially coated with a metal medium layer and an insulation layer to enhance the bonding degree between the encapsulant and the heat ring and heat slug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.